阿斯麦也正在和其他两个最大的客户三星、台湾积体电路制造股份有限公司进行洽谈商议。阿斯麦愿意出售自身所有股份的25%。
Of Intel s R D money, 553m will go on technology to make chips on silicon wafers450mm in diameter.
英特尔公司的研发经费中有5.53亿欧元将用于研发用直径450毫米的硅晶圆制作芯片的技术。
Twice as many chips could be cut from these as from today s biggest, which are 300mmacross.
与目前利用直径最大的300毫米硅晶圆相比,这种技术切割出来的芯片数大一倍。
The rest of the cash is for extreme ultraviolet technology, which the industry hopes will pushthe width of circuits below today s frontier of 20 nanometres.
其余的资金将用于远紫外线光刻技术的研发,业内希望这项技术能令电路打破目前20纳米宽的下限。
This will enable more circuitry to be packed onto smaller chipsand allow the life of Moore slaw, which says that the number of transistors on a chip doubles every 18 months or so, to beextended yet again.
这将使更小的芯片上能封装更多线路并使得摩尔定律的寿命再次得到延长,摩尔定律即集成电路芯片上所集成的电路的数目,大约每隔18个月就翻一番。
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